Stay updated and connected with the Henkel Packaging Adhesives Newsletter Make the most of our expertise: Be the first to discover the latest updates and product innovations that will benefit your packaging and paper business. Read More
Higher productivity, ease of handling and no nickel New Henkel solutions enable greater cost-efficiency and sustainability in aluminum anodizing Read More
Henkel to Partner with HP to Develop 3D Material Solutions Henkel Adhesive Technologies has joined the HP Open Materials and Applications Platform and will work with HP in its Corvallis, Oregon 3D Materials and Applications lab to develop customized, industry-specific solutions for HP Multi Jet Fusion™ customers. Read More
Don’t let a little fastener become a big problem - Use LOCTITE® Threadlocker Mechanical locking devices were invented to solve the common problem of loosening that happens in most threaded assemblies. Read More
LOCTITE® creates a unique brand identity across the globe The LOCTITE® bottle has become the iconic symbol of quality, high performance and innovation in adhesives technology. Read More
Thermal Gel from Henkel lets 5G Telecom Components go Vertical Irvine, California – As the 5G wireless broadband connection standard continues to gain traction, development and deployment of next-generation systems that can reliably manage high volumes of mobile data processing and transfer are accelerating. Working to help telecom device designers achieve critical in-field robustness and reliability, Henkel today announced the launch of a new gel thermal interface material (TIM) that can withstand the environmental and positioning demands of today’s infrastructure components. BERGQUIST® LIQUI-FORM® TLF 6000HG is a thermally conductive, dispensable, pre-cured gel that offers stable viscosity in storage and in use. The material, which can accommodate gaps up to 3.0 mm, offers production simplicity as the pre-cured formulation requires no mixing or refrigeration. Once applied, the 6.0 W/m-K TIM gel maintains its form and position, which is critical for telecom devices that may be placed vertically in outdoor environments... Read More
New Liquid GAP FILLER from Henkel Delivers Thermal Control, Automation and Reworkability Peelable TIM formulation enables easy assembly rework. Read More
Henkel Highlights Thermal Management Solutions at The Battery Show North America 2018 Henkel highlights its latest TIM products, as well as its connecting and protecting materials in booth 311 from September 11 – 13 at The Battery Show North America 2018. Read More
Micro-Thermal Interface Material Coatings from Henkel Land Award Win, Portfolio Expansion Underway Novel Thermal Management Coatings Aid in Reducing Operational Heat in Cloud and Hyperscale Data Center Optical Transceivers Read More