LOCTITE® ABLESTIK 2033SC
Known as ABLEBOND 2033SC (13G)
Features and Benefits
LOCTITE ABLESTIK 2033SC, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK 2033SC die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries.
- Non-conductive
- Single component
- Long work life
- Low bleed
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 56.0 ppm/°C , 133.0 ppm/°C |
| Cure schedule, Alternate 2 @ 150.0 | 10.0 sec. |
| Cure schedule, Alternate @ 120.0 | 60.0 sec. |
| Cure schedule, Recommended @ 110.0 | 90.0 sec. |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 29.0 ppm |
| Extractable ionic content, Potassium (K+) | 4.0 ppm |
| Extractable ionic content, Sodium (Na+) | 14.0 ppm |
| Glass transition temperature (Tg) | 46.0 °C |
| Key characteristics | Cure speed: fast cure, Stress: low stress |
| Tensile modulus, @ 200.0 | 60.0 N/mm² (8600.0 psi ) |
| Thixotropic index | 6.1 |
| Viscosity, Brookfield CP51, @ 25.0 | 11300.0 mPa·s (cP) |
LOCTITE® ABLESTIK 2033SC
LOCTITE ABLESTIK 2033SC, Proprietary Hybrid Chemistry, Die Attach