LOCTITE® ABLESTIK 958-8C
Features and Benefits
LOCTITE ABLESTIK 958-8C, Epoxy, Die Attach
LOCTITE® ABLESTIK 958-8C is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metalizations or traditional printed circuit board surfaces
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Technical Information
| Applications | Die attach |
| Cure schedule, @ 150.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Shear strength, Aluminum | 2150.0 psi |
| Storage temperature | -40.0 °C |
| Thixotropic index | 4.1 |
| Viscosity, cone & plate, @ 25.0 °C | 22000.0 mPa·s (cP) |
| Volume resistivity | 0.005 Ohm cm |
LOCTITE® ABLESTIK 958-8C
LOCTITE ABLESTIK 958-8C, Epoxy, Die Attach