LOCTITE® ECCOBOND E 1172 A

功能與優點

One-part, epoxy-based underfill encapsulant for use on flip-chip devices with as small as 25 μm geometries.
When you want an underfill designed for use on very fine area array devices where SMT transparent processing is critical, LOCTITE® ECCOBOND E 1172 A is an excellent choice. This void-free, epoxy-based underfill encapsulant can be used on flip-chip devices with as small as 25-micron geometries. When applied, LOCTITE® ECCOBOND E 1172 A provides a uniform encapsulation with a strong adhesive force, maximizing the device's temperature cycling capability by distributing stress away from solder connects.
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技術資訊

建議固化方式, @ 135.0 °C 6.0 分
玻璃化溫度(Tg) 135.0 °C
粘度,Brookfield, Spindle 3, speed 5 rpm 17000.0 mPa.s (cP)