LOCTITE® ECCOBOND E 1172 A
功能與優點
One-part, epoxy-based underfill encapsulant for use on flip-chip devices with as small as 25 μm geometries.
When you want an underfill designed for use on very fine area array devices where SMT transparent processing is critical, LOCTITE® ECCOBOND E 1172 A is an excellent choice. This void-free, epoxy-based underfill encapsulant can be used on flip-chip devices with as small as 25-micron geometries. When applied, LOCTITE® ECCOBOND E 1172 A provides a uniform encapsulation with a strong adhesive force, maximizing the device's temperature cycling capability by distributing stress away from solder connects.
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技術資訊
| 建議固化方式, @ 135.0 °C | 6.0 分 |
| 玻璃化溫度(Tg) | 135.0 °C |
| 粘度，Brookfield, Spindle 3, speed 5 rpm | 17000.0 mPa.s (cP) |
LOCTITE® ECCOBOND E 1172 A
One-part, epoxy-based underfill encapsulant for use on flip-chip devices with as small as 25 μm geometries.