LOCTITE® ECCOBOND E 1172 A
Features and Benefits
This 1-part, epoxy-based underfill encapsulant is designed for use on flip chip devices with as small as 25 μm geometries.
LOCTITE® ECCOBOND E 1172 A is a void-free, epoxy-based underfill encapsulant designed for use on very fine area array devices where SMT transparent processing is critical. It can be used on flip chip devices with as small as 25-micron geometries. When applied, it provides a uniform encapsulation with a strong adhesive force, maximising the device’s temperature cycling capability by distributing stress away from solder connections.
- Void-free
- Provides a uniform encapsulation
- Suitable for very fine area array devices
- Strong adhesive force
Documents and Downloads
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Technical Information
| Cure schedule, @ 135.0 °C | 6.0 min. |
| Glass transition temperature (Tg) | 135.0 °C |
| Viscosity, Brookfield, Spindle 3, speed 5 rpm | 17000.0 mPa·s (cP) |
LOCTITE® ECCOBOND E 1172 A
This 1-part, epoxy-based underfill encapsulant is designed for use on flip chip devices with as small as 25 μm geometries.