LOCTITE® ECCOBOND EN 3838T
功能與優點
LOCTITE ECCOBOND EN 3838T, Epoxy, Encapsulant
LOCTITE® ECCOBOND EN 3838T is designed to provide an flexible, low Tg material for encapsulating components on a PCB. When cured, this material provides physical protection and stable electronic performance and protection in temperature/humidity/bias testing.
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技術資訊
| 固化類型 | 熱固化 |
| 建議固化方式, @ 130.0 °C | 8.0 分 |
| 熱膨脹係數 (CTE), Above Tg | 217.0 ppm/°C |
| 熱膨脹係數 (CTE), Below Tg | 57.0 ppm/°C |
| 玻璃化溫度(Tg) | 2.0 °C |
| 粘度，Brookfield CP51, @ 25.0 °C Speed 20 rpm | 6700.0 mPa.s (cP) |
LOCTITE® ECCOBOND EN 3838T
LOCTITE ECCOBOND EN 3838T, Epoxy, Encapsulant