LOCTITE® 3131
功能與優點
LOCTITE 3131, Epoxy/Acrylate, Assembly, Dual Cure Adhesive
LOCTITE® 3131 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. The maximum performance of this material is achieved by exposure to UV light of sufficient intensity, followed by thermal cure.
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技術資訊
| 儲存溫度 | 2.0 - 8.0 °C |
| 剪切強度 | 261.0 psi |
| 固化類型 | 熱固化 |
| 建議固化方式, @ 60.0 °C | 30.0 分 |
| 建議固化方式, @ 70.0 °C | 25.0 分 |
| 建議固化方式, @ 80.0 °C | 20.0 分 |
| 建議固化方式光強度 | 100.0 mW/cm² |
| 粘度，錐型和板型，Haake PK100、PK1，2° | 14000.0 mPa.s (cP) |
| 觸變指數 | 1.6 |
| 零組件數 | 1 組分 |
LOCTITE® 3131
LOCTITE 3131, Epoxy/Acrylate, Assembly, Dual Cure Adhesive