LOCTITE® ABLESTIK ABP 2100AC
被稱為 ABP-2100AC (35g)
功能與優點
LOCTITE ABLESTIK ABP 2100AC, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK ABP 2100AC die attach adhesive is designed for Pb-free array packaging. This product is able towithstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.
瞭解更多
技術資訊
| Coefficient of thermal expansion (CTE) | 65.0 ppm/°C |
| 固化類型 | 熱固化 |
| 應用 | 晶片焊接 |
LOCTITE® ABLESTIK ABP 2100AC
LOCTITE ABLESTIK ABP 2100AC, Proprietary Hybrid Chemistry, Die Attach