Enable faster production speeds with highly fluorescent adhesives for high speed inspection

The TAG Heuer Porsche Formula E Team races in the ABB FIA Formula E World Championship, the most innovative motorsport series.

One-stop process portfolio for all needs in metal surface treatment

Good Packaging Design Starts With the Right Components

10.0 W/m-K BERGQUIST^® LIQUI FORM Gel Tackles Heat Management Challenges in High Bandwidth Systems

Irvine, CA – Staying ahead of thermal management requirements for increasingly challenging datacom, telecom and industrial automation applications, Henkel today announced the commercialization of its latest gel thermal interface material (TIM), BERGQUIST^® LIQUI FORM TLF 10000.  The one-part, high thermal conductivity dispensable gel is designed to provide robust heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.  

Larger, higher-power devices such as ASICs and FPGAs are the norm in 5G telecom infrastructure gear, data center switches, routers and servers, as well as electric vehicle (EV) infrastructure and industrial automation electronics. As component density and complexity increase in response to faster data processing and ...

Dual Cure, Active Alignment Optical Adhesive Delivers High Precision Performance for Optimal Transceiver Signal Integrity