LOCTITE® ECCOBOND F 112
Features and Benefits
This low-viscosity, 2-part, non-conductive adhesive is specially formulated for fibre-optic assembly applications. It is resistant to both thermal shock and impact.
LOCTITE® ECCOBOND F 112 is a 2-part, low-viscosity, electrically non-conductive adhesive for fibre-optic assembly applications. It is thermal shock- and impact-resistant, and offers low stress connections with no pistoning. It’s also ideal for multi-mode and single mode connectors, and small potting and sealing applications.
- 2-part: mixing required
- Low viscosity
- Thermal shock- and impact-resistant
- Low stress connections with no pistoning
- Electrically non-conductive
Documents and Downloads
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Technical Information
| Cure schedule, @ 25.0 °C | 1.0 hr. |
| Cure type | Heat cure |
| Number of components | 2 part |
| Shear strength, Aluminium | 3000.0 psi |
| Storage temperature | 27.0 °C |
| Thixotropic index | 1.0 |
| Viscosity, @ 25.0 °C | 1800.0 mPa·s (cP) |
LOCTITE® ECCOBOND F 112
This low-viscosity, 2-part, non-conductive adhesive is specially formulated for fibre-optic assembly applications. It is resistant to both thermal shock and impact.