LOCTITE® ECCOBOND F 112
Características e Benefícios
This low viscosity, 2-part non-conductive adhesive is specially formulated for fiber optic assembly applications. It is resistant to both thermal shock and impact.
If you’re looking for an electrically non-conductive adhesive for fiber optic assembly applications, try LOCTITE® ECCOBOND F 112. This 2-part low-viscosity product is thermal shock and impact resistant, and offers low stress connections with no pistoning. It’s also ideal for multimode and single mode connectors, and small potting and sealing applications.
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Informação Técnica
| Cronograma de cura, @ 25.0 °C | 1.0 hr. |
| Força de cisalhamento, Alumínio | 3000.0 psi |
| Número de componentes | Bicomponente |
| Temperatura de armazenamento | 27.0 °C |
| Tipo de cura | Cura por Calor |
| Viscosidade, @ 25.0 °C | 1800.0 mPa.s (cP) |
| Índice tixotrópico | 1.0 |
LOCTITE® ECCOBOND F 112
This low viscosity, 2-part non-conductive adhesive is specially formulated for fiber optic assembly applications. It is resistant to both thermal shock and impact.