BERGQUIST® SIL PAD® TSP 1800
Zināms kā Sil-Pad® 1200
Iezīmes un ieguvumi
Thermally conductive, fiberglass-reinforced silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.
BERGQUIST® SIL PAD TSP 1800 is a silicone-based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use, as well as an optional adhesive coating. It exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw- and clip-mounted applications.
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Tehniskā informācija
| Krāsa | Melna |
| Liesmas novērtējums | V-0 |
| Nesēja veids | Stikla šķiedra |
| Siltumvadītspēja | 1.8 W/mK |
| Standarta biezums | 0.229 - 0.406 mm |
BERGQUIST® SIL PAD® TSP 1800
Thermally conductive, fiberglass-reinforced silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.