BERGQUIST® GAP PAD® TGP HC3000
Zināms kā Gap Pad® HC 3.0
Iezīmes un ieguvumi
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.
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Tehniskā informācija
| Darbības temperatūra | -60.0 - 200.0 °C |
| Junga modulis, ASTM D575 | 110.0 KPa (16.0 psi ) |
| Krāsa | Zila |
| Liesmas novērtējums | V-0 |
| Nesēja veids | Stikla šķiedra |
| Siltumvadītspēja | 3.0 W/mK |
| Standarta biezums | 0.508 - 3.175 mm |
BERGQUIST® GAP PAD® TGP HC3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.