Henkel Dual Cure Adhesives Enables Camera Module Success The camera module industry is the focus of much attention, as the addition of camera features into mobile devices — and now into the automotive segment — is driving manufacturers to develop camera technologies that capitalize on this sector’s growth. The more advanced the camera modules become, particularly as pixels and lens quantity increase, a different technique called ‘Active Alignment’ is employed, which requires dual-cure adhesives with UV and thermal cure capabilities to bond the lens holder to the substrate. Read More
Henkel to Debut New Materials, Share Expertise at IPC APEX Expo 2018 High-visibility masking material, low-voiding and jetting solder pastes on display. Read More
Henkel Develops Advanced Solder Paste Test Vehicle Novel test vehicle addresses miniaturization realities. Read More