BERGQUIST GAP FILLER TGF 1100SF
Terkenal sebagai Gap Filler 1100SF
fitur dan keuntungan
BERGQUIST GAP FILLER TGF 1100SF is a silicone free (SF), high-performance gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1100SF is a two component, thermally conductive, silicone free liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. It helps reduce thermal stresses during operation.
- Thermal Conductivity: 1.1 W/m-k
- No silicone outgassing or extraction
- Ultra-conforming, designed for fragile and low-stress applications
- Ambient and accelerated cure schedules
Dokumen dan Unduhan
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Informasi Teknis
Jadwal Pengerasan, Disarankan @ 25.0 °C | 24.0 hr. |
Kapasitas Panas, ASTM E1269 | 0.9 J/g-K |
Kekerasan Shore, Thirty second delay value, ASTM D2240 Shore 00 | 60.0 |
Konduktivitas Termal | 1.1 W/mK |
Konstanta Dielektrik, @ 1kHz | 5.0 |
Massa Jenis | 2.0 g/cm³ |
Rasio Campuran, menurut Berat | 1 : 1 |
Rasio Campuran, menurut Volume | 1 : 1 |
Resistivitas Volume | 1×10 Ohm m |
Suhu Penyimpanan | 25.0 °C |
Tingkat Nyala Api | V-0 |
Umur Simpan | 6.0 mon. |
Waktu Masa Campur, @ 25.0 °C | 4.0 hr. |
Resin | |
Warna, Resin | Kuning |
Pengeras | |
Warna, Pengeras | Merah |