BERGQUIST GAP FILLER TGF 1100SF

Terkenal sebagai Gap Filler 1100SF

fitur dan keuntungan

BERGQUIST GAP FILLER TGF 1100SF is a silicone free (SF), high-performance gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1100SF is a two component, thermally conductive, silicone free liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. It helps reduce thermal stresses during operation.
  • Thermal Conductivity: 1.1 W/m-k
  • No silicone outgassing or extraction
  • Ultra-conforming, designed for fragile and low-stress applications
  • Ambient and accelerated cure schedules
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Informasi Teknis

Jadwal Pengerasan, Disarankan @ 25.0 °C 24.0 hr.
Kapasitas Panas, ASTM E1269 0.9 J/g-K
Kekerasan Shore, Thirty second delay value, ASTM D2240 Shore 00 60.0
Konduktivitas Termal 1.1 W/mK
Konstanta Dielektrik, @ 1kHz 5.0
Massa Jenis 2.0 g/cm³
Rasio Campuran, menurut Berat 1 : 1
Rasio Campuran, menurut Volume 1 : 1
Resistivitas Volume 1×10 Ohm m
Suhu Penyimpanan 25.0 °C
Tingkat Nyala Api V-0
Umur Simpan 6.0 mon.
Waktu Masa Campur, @ 25.0 °C 4.0 hr.
Resin
Warna, Resin Kuning
Pengeras
Warna, Pengeras Merah

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