Henkel's range of BMI-based adhesives enabled the proliferation of array type packaging when it was first introduced. Continuing this tradition, Henkel is facilitating advances in IC packaging with new material systems designed for high performance and reliability in small formats, such as LGA devices, all the way to very large format system-in-package and system-in-module technology. Whether paste, liquid or film, Henkel's materials are engineered for maximum efficiency and are developed in conjunction with leading-edge applications, giving semiconductor specialists the peace of mind to confidently integrate our materials for the most demanding processes and requirements.

Henkel Solutions for Laminate Packages

Resources for Wirebond Laminate Packaging

Brochure: Materials for Wirebond Packaging

Download

Contact us

Please fill out the form below and we’ll respond shortly.

There are some errors, please correct them below.
What would you like to request?
This field is required
This field is required
This field is required
This field is required
This field is required
This field is invalid