Electrically Conductive Adhesives

Henkel’s LOCTITE^® ECCOBOND line of snap curable conductive adhesives provides excellent adhesion and reliability, cure times of less than two minutes, and in-line processing capability for exceptionally high throughput. For applications with large coefficient of thermal expansion (CTE) mismatches between substrates, or fine-pitch flip-chip interconnections where electrical conductivity is desired in only one direction, Henkel has an electrically conductive adhesive to meet the challenge.

Electrically conductive heat cure adhesives are required for a number of manufacturing challenges such as die to substrate bonding, passive component attach and the bonding of heat-sensitive components. The Henkel line includes products from such trusted brands as LOCTITE^® ECCOBOND and LOCTITE^® ABLESTIK, , with varying cure speeds, viscosity and pot life.

Our electrically-conductive adhesive products cure at room temperature and can be used for bonding and sealing applications for heat-sensitive devices that require superior electrical and mechanical properties, with no heating equipment required.

Henkel’s two-component electrically conductive adhesives require no refrigeration or freezer storage and include products that provide high peel and tensile lap shear strength over a broad temperature range; as well as silver-filled epoxies recommended for electronic bonding and sealing applications that comply with the requirements of NASA’s outgassing specification.