Optical Sub Assembly

Data center optical transceivers are the fiber optics network interfaces between switches, routers, servers, optical line systems and wireless access points. Instrumental in determining the performance of the entire network, the dependable function of internal transceiver components – the transmitter optical subassembly (TOSA), receiver optical subassembly (ROSA), and bi-directional optical subassembly (BOSA) -- is critical to the movement of more data at higher speeds. Within the TOSA and ROSA, Henkel materials are providing the strong, precise bonds and thermal control required for next-generation 400 GbE transceiver power and speed.

Optical Sub-Assembly Applications

Laser Diode Bonding

Next-generation laser diodes are faster, operating at lower current and higher temperatures to enable reliable 400 Gbit/sec. connections over single-mode fiber. In order for network operators to transition to highly meshed networks, new laser packages must deliver bandwidth/speed, lower power consumption and do so within a reliable non-hermetic design so as to further reduce the cost and footprint. Henkel’s die-attach portfolio, including high thermal semi-sintering materials, deliver a solder alternative with best-in-class thermal performance. This technology provides laser package designers lower in-package thermal resistance, excellent reworkability and robust adhesion on small and medium die sizes, providing high reliability and manufacturing flexibility.

Active Alignment and Bonding (OSA)

A high-speed, precise active optical alignment process enables accurate, cost-effective production of optical sub-assemblies such as TOSA, ROSA, BOSA. Henkel’s dual-cure UV adhesives are designed to precisely align optical components with a two-phase, quick-cure adhesion mechanism that holds and then secures the miniaturized components in place. Over the long-term, optical component performance is ensured through Henkel adhesives’ stability-enhancing attributes such as low shrinkage, low CTE, good light transmittance, low moisture absorption and high reliability.

Structural Bonding

LOCTITE^® structural adhesives are used throughout optoelectronics devices to facilitate PEI lens bonding and sealing, OSA backfill, and staking of the TOSA/ROSA/BOSA flexible printed circuit to the PCB. Available in a range of different chemistries to accommodate process preferences, LOCTITE^® adhesives are compatible with multiple surfaces including metals, glass and plastics.

Optical Sub Assembly