BERGQUIST® GAP PAD® TGP 800VOS
Connu sous le nom de Gap Pad® VO Soft
Caractéristiques et avantages
This silicone, thermally conductive gap pad has high conformability and is ideal for a wide range of applications.
BERGQUIST® GAP PAD TGP 800VOS is a silicone, thermally conductive, highly conformable gap pad offering enhanced resistance against puncture, shear and tear. It is electrically isolating and recommended for applications that require minimum pressure on components. It is ideal for use between any heat source and heat sink in telecommunications, computers and power conversion.
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Informations techniques
| Capacité thermique, ASTM E1269 | 1.0 J/g-K |
| Conductivité thermique | 0.8 W/mK |
| Constante diélectrique, @ 1kHz | 5.5 |
| Cote d'inflammabilité | V-0 |
| Densité | 1.6 g/cm³ |
| Dureté Shore, Thirty second delay value, ASTM D2240 Caoutchouc en vrac Shore 00 | 25.0 |
| Résistivité volume | 1×10 Ohm m |
| Température de service | -60.0 - 200.0 °C |
| Tension de rupture diélectrique | 6000.0 Vac |
| Épaisseur standard | 0.508 - 5.08 mm |
BERGQUIST® GAP PAD® TGP 800VOS
This silicone, thermally conductive gap pad has high conformability and is ideal for a wide range of applications.