BERGQUIST® GAP PAD® TGP 800VOS
Conhecido como Gap Pad® VO Soft
Características e Benefícios
This silicone, thermally conductive gap pad has high conformability and is ideal for a wide range of applications.
BERGQUIST® GAP PAD TGP 800VOS is a silicone, thermally conductive, highly conformable gap pad offering enhanced resistance against puncture, shear and tear. It is electrically isolating and recommended for applications that require minimum pressure on components. It is ideal for use between any heat source and heat sink in telecommunications, computers and power conversion.
Ler mais
Documentos e Downloads
Procurando por um TDS ou MSDS / FISPQ em outro idioma?
Documentação Adicional
Informação Técnica
| Capacidade de calor, ASTM E1269 | 1.0 J/g-K |
| Classificação da chama | V-0 |
| Condutividade térmica | 0.8 W/mK |
| Constante dielétrica, @ 1kHz | 5.5 |
| Densidade | 1.6 g/cm³ |
| Dureza shore, Thirty second delay value, ASTM D2240 Borracha à granel Shore 00 | 25.0 |
| Espessura padrão | 0.508 - 5.08 mm |
| Resistividade volumétrica | 1×10 Ohm m |
| Temperatura de operação | -60.0 - 200.0 °C |
| Tensão de ruptura dielétrica | 6000.0 Vac |
BERGQUIST® GAP PAD® TGP 800VOS
This silicone, thermally conductive gap pad has high conformability and is ideal for a wide range of applications.