BERGQUIST® GAP PAD® TGP 800VOS
Conocido como Gap Pad® VO Soft
Características y Ventajas
This silicone, thermally conductive gap pad has high conformability and is ideal for a wide range of applications.
BERGQUIST® GAP PAD TGP 800VOS is a silicone, thermally conductive, highly conformable gap pad offering enhanced resistance against puncture, shear and tear. It is electrically isolating and recommended for applications that require minimum pressure on components. It is ideal for use between any heat source and heat sink in telecommunications, computers and power conversion.
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Información técnica
| Capacidad calorífica, ASTM E1269 | 1.0 J/g-K |
| Conductividad térmica | 0.8 W/mK |
| Constante dieléctrica, @ 1kHz | 5.5 |
| Densidad | 1.6 g/cm³ |
| Dureza shore, Thirty second delay value, ASTM D2240 Goma a granel Shore 00 | 25.0 |
| Espesor | 0.508 - 5.08 mm |
| Resistencia a la flama | V-0 |
| Resistividad de volumen | 1×10 Ohm m |
| Temperatura de funcionamiento | -60.0 - 200.0 °C |
| Tensión de ruptura dieléctrica | 6000.0 Vac |
BERGQUIST® GAP PAD® TGP 800VOS
This silicone, thermally conductive gap pad has high conformability and is ideal for a wide range of applications.