BERGQUIST® BOND PLY TBP 720LMS
Известен като Bond-Ply® LMS 1000
Характеристики и ползи
BERGQUIST BOND PLY TBP 720LMS, Low Modulus Silicone, Heat Cured, Laminating Adhesive
BERGQUIST® BOND PLY TBP 720LMS is a thermally conductive fiber reinforced heat curable laminating adhesive film. The product consists of a high performance, thermally conductive, low modulus silicone compound coated on a fiberglass weave and double lined with protective films. The low modulus silicone design effectively absorbs mechanical stresses induced by assembly-level CTE mismatch or Shock and Vibration while providing exceptional thermal performance (vs PSA technologies) and long-term integrity BERGQUIST BOND PLY TBP 720LMS is typically used for fastening power components and printed circuit assemblies to heat sinks
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Техническа информация
Стандартна дебелина | 0.2032 mm |
Цвят | Светлокафяв |