BERGQUIST® BOND PLY TBP 720LMS

Відомий як Bond-Ply® LMS 1000

Особливості та переваги

BERGQUIST BOND PLY TBP 720LMS, Low Modulus Silicone, Heat Cured, Laminating Adhesive
BERGQUIST® BOND PLY TBP 720LMS is a thermally conductive fiber reinforced heat curable laminating adhesive film. The product consists of a high performance, thermally conductive, low modulus silicone compound coated on a fiberglass weave and double lined with protective films. The low modulus silicone design effectively absorbs mechanical stresses induced by assembly-level CTE mismatch or Shock and Vibration while providing exceptional thermal performance (vs PSA technologies) and long-term integrity BERGQUIST BOND PLY TBP 720LMS is typically used for fastening power components and printed circuit assemblies to heat sinks
Дізнайтеся більше

Документи та завантаження

Технічна інформація

Колір світло-коричневий
Стандартна товщина 0.2032 мм