For packaging specialists and device designers, the flexibility, cost and existing infrastructure of wirebonding remain among the technology's primary advantages and fuel its stronghold status. Increased semiconductor use in the automotive sector, among others, will help wirebond IC packaging continue on its growth trajectory, even as other packaging technologies such as flip-chip satisfy small form factor requirements.

Henkel has developed a comprehensive portfolio of advanced materials for various wirebond requirements – from smaller die to pad ratios to thinner bond lines to low stress to high temperature capability and robust adhesion. A wide range of die attach pastes and films, encapsulants, solder pastes, package-level EMI shielding materials, and alternative wafer backside coating (WBC) die attach solutions deliver the process adaptability, cost-effectiveness and in-field reliability necessary for today’s advanced wirebond ICs.

Die Attach Paste

Strong die-to-substrate bonds are the foundation of robust semiconductor packages.

> Learn More

Die Attach Film

Die attach film adhesives have become essential for the production of next-generation semiconductor packages.

> Learn More

Die Attach: Printable B stage

Printable die attach materials provide a viable alternative to standard die attach paste processes, allowing the application of adhesive at the wafer-level.  

> Learn More

Encapsulation

Protection of ICs, particularly as dimensions continue to shrink and more direct chip attach is incorporated, is critical for long-term semiconductor device reliability.  

> Learn More

Resources for Wirebond Semiconductor Packaging

Contact us

Please fill out the form below and we’ll respond shortly.

There are some errors, please correct them below.
What would you like to request?
This field is required
This field is required
This field is required
This field is required
This field is required
This field is required
This field is invalid