LOCTITE® ABLESTIK 2907
Features and Benefits
LOCTITE ABLESTIK 2907, Epoxy, Assembly, Bonding, Sealing or Repair
LOCTITE® ABLESTIK 2907 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. It can also be used as a "cold solder" for heat sensitive components where hot soldering is impractical.
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Technical Information
| Cure schedule, Recommended @ 25.0 °C | 24.0 hr. |
| Cure type | Heat cure |
| Number of components | 2 part |
| Recommended for use with | Ceramic |
| Shear strength, Aluminium | 1200.0 psi |
| Storage temperature | 27.0 °C |
| Thixotropic index | 3.5 |
| Mixed | |
| Viscosity CP52, Mixed Speed 10 rpm | 6500.0 mPa·s (cP) |
LOCTITE® ABLESTIK 2907
LOCTITE ABLESTIK 2907, Epoxy, Assembly, Bonding, Sealing or Repair