LOCTITE® ECCOBOND UF 9000AG
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Good flow with self-filleting High purityThis epoxy-based, black, high-purity underfill encapsulant is for flip-chip BGA and Cu pillar package applications.
LOCTITE® ECCOBOND UF 9000AG is a black, high purity semiconductor underfill encapsulant. It’s typically used for flip-chip BGA and Cu pillar package applications requiring low thermal expansion, fast capillary flow and long work life. It exhibits low resin bleed-out and low die warpage and is proven stable at 260°C (500°F) reflow for Pb-free, low-k applications. LOCTITE® ECCOBOND UF 9000AG is formulated with an epoxy-based resin and cures when exposed to heat. When fully cured, it forms a rigid, protective seal that dissipates stress in solder joints and extends thermal cycling performance.
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LOCTITE® ECCOBOND UF 9000AG
Good flow with self-filleting High purityThis epoxy-based, black, high-purity underfill encapsulant is for flip-chip BGA and Cu pillar package applications.