BERGQUIST® GAP FILLER TGF 4500CVO

功能與優點

A high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Controlled volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 4500CVO is a 4.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It offers infinite thickness variation without causing additional stress to components, and the formula ensures optimal viscosity for efficient automated dispensing processes. This product is curable at room temperature, but the cure rate can be accelerated by applying heat.
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技術資訊

保質期, @ 25.0 °C 180.0 日
固化類型 室溫(環境溫度)固化, 熱固化
導熱性 4.5 W/mK
操作溫度 -60.0 - 200.0 °C