LOCTITE® 3129
功能與優點
A 1-part, medium viscosity, epoxy that is designed to cure at low temperatures to provide excellent adhesion in 5 to 10 minutes.
LOCTITE® 3129 is a 1-part, heat-curable epoxy. It has been specifically designed to cure at low temperatures to provide excellent adhesion on a wide range of materials in under 10 minutes. It’s ideal where low curing temperatures are required for heat sensitive component, for example in memory cards and CCD/CMOS assemblies.
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技術資訊
| 儲存溫度 | -15.0 - -25.0 °C |
| 剪切強度 | 2230.0 psi |
| 卡森粘度，錐型和板型，Haake PK100、PK1，2°, @ 25.0 °C | 4200.0 mPa.s (cP) |
| 固化類型 | 熱固化 |
| 屈服點 | 39000.0 mPa·s |
| 建議固化方式, @ 80.0 °C | 5.0 - 10.0 分 |
| 粘度，錐型和板型，Haake PK100、PK1，2°, @ 25.0 °C Shear Rate 2 s⁻¹ | 46000.0 mPa.s (cP) |
| 粘度，錐型和板型，Haake PK100、PK1，2°, @ 25.0 °C Shear Rate 20 s⁻¹ | 12000.0 mPa.s (cP) |
| 零組件數 | 1 組分 |
LOCTITE® 3129
A 1-part, medium viscosity, epoxy that is designed to cure at low temperatures to provide excellent adhesion in 5 to 10 minutes.