BERGQUIST® GAP PAD® TGP 1100SF

功能与优点

BERGQUIST GAP PAD TGP 1100SF is a silione-free (SF) thermally conductive gap pad which also offers electrical isolation.
BERGQUIST® GAP PAD TGP 1100SF is a silicone-free, thermally conductive gap pad. Being silicone free, there is no silicone outgassing and silicone extraction. It is not only thermally conductive but also electrically isolating. This product is therefore ideal for silicone sensitive applications.
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技术信息

导热性 0.9 W/mK
操作温度 -60.0 - 125.0 °C
标准厚度 0.254 - 3.175 mm
载体类型 玻璃纤维
阻燃性 V-1
颜色 绿色

常见问题