BERGQUIST® GAP PAD® TGP 1100SF
Merkmale und Vorteile
BERGQUIST GAP PAD TGP 1100SF is a silione-free (SF) thermally conductive gap pad which also offers electrical isolation.
BERGQUIST® GAP PAD TGP 1100SF is a silicone-free, thermally conductive gap pad. Being silicone free, there is no silicone outgassing and silicone extraction. It is not only thermally conductive but also electrically isolating. This product is therefore ideal for silicone sensitive applications.
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Technische Informationen
Betriebstemperatur | -60.0 - 125.0 °C |
Entflammbarkeit | V-1 |
Farbe | Grün |
Standarddicke | 0.254 - 3.175 mm |
Träger | Glasfaser |
Wärmeleitfähigkeit | 0.9 W/mK |