LOCTITE® ECCOBOND UF 8830S
功能与优点
LOCTITE ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.
LOCTITE® ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow. When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance.
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技术信息
| 储存温度 | -40.0 °C |
| 储能模量, DMA @ 25.0 °C | 11500.0 N/mm² (1667934.0 psi ) |
| 热膨胀系数 (CTE), Above Tg | 100.0 ppm/°C |
| 热膨胀系数 (CTE), Below Tg | 25.0 ppm/°C |
| 玻璃化温度 (Tg) | 118.0 °C |
| 粘度，博勒菲, @ 25.0 °C Spindle 51, Speed 5 rpm | 22120.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 8830S
LOCTITE ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.