LOCTITE® ECCOBOND UF 8830S
Features and Benefits
LOCTITE ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.
LOCTITE® ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow. When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance.
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 100.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 25.0 ppm/°C |
| Glass transition temperature (Tg) | 118.0 °C |
| Storage modulus, DMA @ 25.0 °C | 11500.0 N/mm² (1667934.0 psi ) |
| Storage temperature | -40.0 °C |
| Viscosity, Brookfield, @ 25.0 °C Spindle 51, Speed 5 rpm | 22120.0 mPa·s (cP) |
LOCTITE® ECCOBOND UF 8830S
LOCTITE ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.