LOCTITE® ABLESTIK QMI536
Features and Benefits
LOCTITE ABLESTIK QMI536, Bismaleimide Resin, Die Attach, Fluoropolymer Filled Non-conductive Adhesive
LOCTITE® ABLESTIK QMI536 is a Fluoropolymer filled non-conductive adhesive for attachment of integrated circuits and components to advanced substrates, including PBGAs, CSPs, array packages, and stacked die. This material is hydrophobic and stable at high temperatures. These features produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic and metal surfaces, including solder mask, BT, FR, polyimide, and Au. The adhesive also has excellent dielectric properties. LOCTITE ABLESTIK QMI536 can be cured in a conventional oven, on a snap cure oven, or utilize Skip Cure processing on a die bonder or wire bonder. The material is formulated to produce cure onset below 100°C. This can reduce or eliminate the need to pre-dry organic substrates prior to the die attach process. Please refer to the TDS for alternate cure times.
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Technical Information
Application method | Dispense system |
Applications | Die attach |
Coefficient of thermal expansion (CTE) | 98.0 ppm/°C , 174.0 ppm/°C |
Color | White |
Cure type | Heat cure |
Density | 1.3 g/cm³ |
Extractable ionic content, Chloride (CI-) | 20.0 ppm |
Extractable ionic content, Fluoride (F-) | 20.0 ppm |
Extractable ionic content, Potassium (K+) | 20.0 ppm |
Extractable ionic content, Sodium (Na+) | 20.0 ppm |
Glass transition temperature (Tg) | -31.0 °C |
Key characteristics | Adhesion: good adhesion, Alpha emissions: ultra low alpha emissions, Cure speed: very fast, Dielectric, Dispensibility: good dispensibility, Lead free process compatible, Modulus: low modulus, Stress: low stress |
Modulus, @ 25.0 | 0.3 GPa (300.0 N/mm² , 43500.0 psi ) |
Number of components | 1 part |
Physical form | Paste |
RT die shear strength | 17.0 kg-f |
Recommended for use with | Laminate, Polyimide |
Thermal conductivity | 0.3 W/mK |
Thixotropic index | 5.7 |
Viscosity | 8500.0 mPa·s (cP) |