LOCTITE® ABLESTIK QMI536
Features and Benefits
This 1-part, non-conductive die-attach adhesive is used for attaching integrated circuits and components to advanced substrates.
LOCTITE® ABLESTIK QMI536 is a white, non-conductive die-attach adhesive for attaching integrated circuits and components to advanced substrates, including PBGAs, CSPs, array packages, and stacked die. It’s formulated with a fluoropolymer-filled bismaleimide resin and cures when exposed to heat. It produces a void-free bond line with excellent interfacial strength to various organic and metal surfaces, including solder masks, BT, FR, polyimide, and Au. LOCTITE ABLESTIK QMI536 can be cured in a conventional oven, on a snap-cure oven, or by utilizing SkipCure™ processing on a die or wire bonder. It’s designed to produce cure onset below 212°F (100°C). This can reduce or eliminate the need to pre-dry organic substrates before the die-attach process.
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Technical Information
| Application method | Dispense system |
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 98.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 174.0 ppm/°C |
| Color | White |
| Cure type | Heat cure |
| Density, Maximum Final | 1.3 g/cm³ |
| Extractable ionic content, Chloride (CI-) | 20.0 ppm |
| Extractable ionic content, Fluoride (F-) | 20.0 ppm |
| Extractable ionic content, Potassium (K+) | 20.0 ppm |
| Extractable ionic content, Sodium (Na+) | 20.0 ppm |
| Glass transition temperature (Tg) | -31.0 °C |
| Key characteristics | Adhesion: good adhesion, Alpha emissions: ultra low alpha emissions, Cure speed: very fast, Dielectric, Dispensibility: good dispensibility, Lead free process compatible, Modulus: low modulus, Stress: low stress |
| Modulus, DMA @ 25.0 °C | 0.3 GPa (300.0 N/mm² , 43500.0 psi ) |
| Number of components | 1 part |
| Physical form | Paste |
| RT die shear strength, 7.6 x 7.6 mm Si die on Ag plated Cu leadframe | 17.0 kg-f |
| Recommended for use with | Laminate, Polyimide |
| Thermal conductivity | 0.3 W/mK |
| Thixotropic index | 5.7 |
| Viscosity | 8500.0 mPa·s (cP) |
LOCTITE® ABLESTIK QMI536
This 1-part, non-conductive die-attach adhesive is used for attaching integrated circuits and components to advanced substrates.