LOCTITE® ABLESTIK QMI529HT-LV
Elementi i pogodnosti
This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.
As the market leader and top innovator of the most advanced die attach solutions, LOCTITE® ABLESTIK® adhesives deliver superior die packaging reliability performance – and LOCTITE® ABLESTIK QMI529HT-LV is no exception. Specially designed for use in high throughput applications, this product is hydrophobic with low moisture absorption, thermally and electrically conductive, and stable at high temperatures. You can also expect great dispensing characteristics. LOCTITE® ABLESTIK QMI529HT-LV passes NASA outgassing and MIL-STD-883 standards, Method 5011.
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Dokumenti i preuzimanja
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Tehnički podaci
Jonski sadržaj koji se izvlači, Fluorid (F-) | 9.0 ppm |
Jonski sadržaj koji se izvlači, Hlorid (Cl-) | 9.0 ppm |
Jonski sadržaj koji se izvlači, Kalijum (K+) | 9.0 ppm |
Jonski sadržaj koji se izvlači, Natrijum (Na+) | 9.0 ppm |
Koeficijent toplotnog širenja (CTE) | 62.0 ppm/°C |
Modul elastičnosti, @ 250.0 °C | 738.0 N/mm² (107037.0 psi ) |
Primene | Dodavanje boje |
Sila smicanja RT kalupa | 20.0 kg-f |
Sila smicanja vrućeg kalupa | 3.75 kg-f |
Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |