BERGQUIST® SIL PAD® TSP 1800
Cunoscut ca Sil-Pad® 1200
Funcții și beneficii
Thermally conductive, fiberglass-reinforced silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.
BERGQUIST® SIL PAD TSP 1800 is a silicone-based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use, as well as an optional adhesive coating. It exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw- and clip-mounted applications.
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Informații tehnice
| Conductivitatea termică | 1.8 W/mK |
| Culoare | Negru |
| Evaluare flacără | V-0 |
| Grosimea standard | 0.229 - 0.406 mm |
| Tip de suport | Fibră de sticlă |
BERGQUIST® SIL PAD® TSP 1800
Thermally conductive, fiberglass-reinforced silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.