BERGQUIST® SIL PAD® TSP 1800
Znany jako Sil-Pad® 1200
Właściwości i korzyści
Thermally conductive, fiberglass-reinforced silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.
BERGQUIST® SIL PAD TSP 1800 is a silicone-based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use, as well as an optional adhesive coating. It exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw- and clip-mounted applications.
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Informacje techniczne
| Grubość standardowa | 0.229 - 0.406 mm |
| Klasa palności | V-0 |
| Kolor | Czarny |
| Przewodność cieplna | 1.8 W/mK |
| Typ nośnika | Włókno szklane |
BERGQUIST® SIL PAD® TSP 1800
Thermally conductive, fiberglass-reinforced silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.