Technology advancement continues to push the semiconductor industry towards ever thinner and higher functioning devices. Henkel introduces the LOCTITE ABLESTIK CDF family of products as a solution that allows robust processing of thinner, smaller, higher-density packages with reduced footprints. This ground-breaking conductive die attach film technology has been brought to the market in a pre-cut format, which enables robust manufacturing. Henkel now offers a portfolio of products which cater to consumer and automotive applications, combining an efficient process with higher reliability (MSL1 packages).
In this webinar, Dr. Gupta will cover the commercial success of products launched over the past years and also introduce participants to the latest developments in Silver Sintering Film technology as a viable Pb Free replacement. He will focus on market drivers, the motivation for developing cDAF products and their advantages in resolving manufacturing and reliability challenges.
Author: Shashi Gupta