The number of semiconductor-based sensors is growing rapidly as the demand for sensing functions tends to evolve. Such sensors typically contain heat-sensitive substrates and components (such as MEMS), which limit the processing temperature of thermally cured adhesives and encapsulants to a maximum of 80°C. In addition to this, more accurate sensing performance requires adhesives with low stress and low warpage for constant and stable function over the operating temperature range. This webinar presents new materials for MEMS, CMOS image and fingerprint sensor type components that meet these requirements.

Author: Ing.Ruud de Wit

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