Adhesivos de película
High-reliability grounding and thermal management solutions for electronic assemblies
Due to the shrinking sizes of assemblies combined with increasing functionality and power requirements, the need for thermal management is critical. Henkel's assembly films not only provide best-in-class electrical, thermal and mechanical performance but also lower total assembly costs through the elimination of inventory maintenance and/or third-party conversion. Henkel's assembly films provide a proven solution for the most demanding applications requiring the highest reliability performance. Henkel provides customized, pre-cut cut film preforms to precisely match highly-complex printed circuit board shapes and patterns. This ensures an exact amount of void-free adhesive with a controlled bondline thickness in a specific area.
