With increasing functionality and power requirements for electronic equipment, the need for thermal management is critical. The demand for uniformed bondline application as well as the avoidance of air inclusions across large areas make epoxy film adhesives essential for many applications in the aerospace, telecommunications, and electronics fields. Luckily, Henkel's assembly films not only provide best-in-class electrical, thermal, and mechanical performance, but also lower total assembly costs through the elimination of inventory maintenance and/or third-party conversion.
Henkel's epoxy assembly films provide a proven solution for the most demanding applications requiring the highest reliability performance. Henkel’s epoxy film adhesives are perfectly suited for large bonding areas that also require uniformed bondlines and custom sizes and shapes. For this reason, we provide customized film preforms to precisely match highly-complexhighly complex printed circuit board shapes and patterns. This ensures an exact amount of void-free adhesive with a controlled bondline thickness in a specific area. Henkel offers heat activated film adhesives that help reduce curing time and increase the efficiency of your work processes.
Contact us today to talk to one of our experts about our custom-cut film adhesive preforms