LOCTITE® ABLESTIK 8387BM
Features and Benefits
LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant
LOCTITE® ABLESTIK 8387BM single component adhesive is designed for high throughput encapsulation applications.
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Technical Information
| Applications | Encapsulating |
| Cure schedule, @ 100.0 °C | 1.0 hr. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Thixotropic index | 4.5 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9200.0 mPa·s (cP) |
LOCTITE® ABLESTIK 8387BM
LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant