BERGQUIST® GAP PAD® TGP 3004SF
Zināms kā Gap Pad® 3004SF
Iezīmes un ieguvumi
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
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Tehniskā informācija
| Blīvums, Maximum Final | 3.2 g/cm³ |
| Cietība, Thirty second delay value, ASTM D2240 Lielgabarīta gumija @ 23.0 °C Shore 00 | 70.0 |
| Darbības temperatūra | -40.0 - 125.0 °C |
| Krāsa | Viegli aptumšots |
| Liesmas novērtējums | V-0 |
| Nesēja veids | 0,25 mil PET plēve |
| Siltumvadītspēja | 3.0 W/mK |
| Standarta biezums | 0.254 - 3.715 mm |
BERGQUIST® GAP PAD® TGP 3004SF
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.