LOCTITE ECCOBOND FP4530

fitur dan keuntungan

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LOCTITE ECCOBOND FP4530, Snap curable, Epoxy, Underfill
LOCTITE® ECCOBOND FP4530 underfill is designed for flip chip on flex applications with a 25micron gap. Upon cure, the material color will change from blue to green.
  • Compatible with small gap sizes
  • Snap curable
  • For flip chip on flex applications with a 25 μm gap
  • Material color will change from blue to green when cured
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Dokumen dan Unduhan

Teknis Lembar Data
LOCTITE ECCOBOND FP4530
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Informasi Teknis

Jadwal Pengerasan, @ 160.0 °C 7.0 min.
Kekentalan, Cone & Plate Brookfield, @ 25.0 °C Spindle 52, speed 20 rpm 3500.0 mPa.s (cP)
Koefisien Muai Termal (CTE), Above Tg 150.0 ppm/°C
Koefisien Muai Termal (CTE), Below Tg 46.0 ppm/°C
Suhu Transisi Kaca (Tg) 145.0 °C