LOCTITE® ECCOBOND FP4530

Features and Benefits

LOCTITE ECCOBOND FP4530, Snap curable, Epoxy, Underfill
LOCTITE® ECCOBOND FP4530 underfill is designed for flip chip on flex applications with a 25micron gap. Upon cure, the material color will change from blue to green.
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Technical Information

Coefficient of thermal expansion (CTE), Above Tg 150.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 46.0 ppm/°C
Cure schedule, @ 160.0 °C 7.0 min.
Glass transition temperature (Tg) 145.0 °C
Viscosity, Brookfield Cone & Plate, @ 25.0 °C Spindle 52, speed 20 rpm 3500.0 mPa·s (cP)