BERGQUIST GAP FILLER TGF 1000SR

Terkenal sebagai Gap Filler 1000SR

fitur dan keuntungan

BERGQUIST GAP FILLER TGF 1000SR is a silicone based,thermally conductive, liquid gap filler material.
BERGQUIST® GAP FILLER TGF 1000SR is a two component silicone based thermally conductive, liquid gap filling material that features superior slump resistance.The mixed system will cure at room temperature and can be accelerated with the addition of heat. When cured this product provides a soft, thermally conductive,form-in place elastomer that is ideal for fragile assemblies,capable of filling unique and intricate air voids and gaps. This product is intended for use in automotive electronics applications where a strong structural bond is not necessary
  • Thermal conductivity: 1.0 W/m-K
  • Excellent slump resistance (stays in place)
  • Ultra-conforming, with excellent wet-out for low stress interface applications
  • 100% Solids – no cure by-products
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Informasi Teknis

Konduktivitas Termal 0.1 W/mK
Suhu Operasi -60.0 - 175.0 °C
Teknologi Silikon
Tingkat Nyala Api V-0
Tipe Pengeringan Heat Cure
Pengeras
Warna, Pengeras Putih

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