Thermal gap fillers
Thermally conductive, liquid gap-filler material
Two-part, silicone-based, thermally conductive, liquid gap-filling material with excellent slump resistance (stays in place). Ideal for use in automotive electronics applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® GAP FILLER TGF 1000SR is a 2-part, silicone based, thermally-conductive liquid gap filling material that features superior slump resistance. The mixed system will cure at room temperature and can be accelerated with the addition of heat. Once cured, it provides a soft, thermally conductive, form-in place elastomer ideal for fragile assemblies, capable of filling unique and intricate air voids and gaps. It has excellent low and high temperature mechanical and chemical stability, and is intended for use in automotive electronics applications.
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Excellent slump resistance
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Excellent low and high temperature stability
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Ultra-conforming
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Excellent wet-out for low stress interface applications
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Thermal conductivity: 1.0 W/m-K
Cure type:
Heat cure
Flame rating:
V-0
Hardener: Color:
White
Operating temperature:
-60.0 °C - 175.0 °C
Thermal conductivity:
0.1 W/mK