LOCTITE ABLESTIK ABP 2035SCR

fitur dan keuntungan

Unduh TDS
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
  • Non-conductive
  • Single component
  • Fast cure
  • Low cure temperature
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Informasi Teknis

Aplikasi Pelekat Die
Indeks Tiksotropik 4.0
Koefisien Muai Termal (CTE) 50.0 ppm/°C
Koefisien Muai Termal (CTE), Above Tg 135.0 ppm/°C
Konduktivitas Termal 1.0 W/mK
Suhu Transisi Kaca (Tg) 118.0 °C
Tipe Pengeringan Heat Cure
Viskositas, Brookfield CP51, @ 25.0 °C Speed 5 rpm 9830.0 mPa.s (cP)