LOCTITE® ABLESTIK ABP 2035SCR

Caractéristiques et avantages

LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
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Informations techniques

Applications Soudage de puce
Coefficient de dilatation thermique (CDT) 50.0 ppm/°C
Coefficient de dilatation thermique (CDT), Above Tg 135.0 ppm/°C
Conductivité thermique 0.4 W/mK
Indice thixotropique 4.0
Température de transition vitreuse 118.0 °C
Type de polymérisation Polymérisation par la chaleur
Viscosité, Brookfield CP51, @ 25.0 °C Speed 5 rpm 9830.0 mPa.s (cP)