LOCTITE® ABLESTIK ABP 2035SCR

Features and Benefits

LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 50.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 135.0 ppm/°C
Cure type Heat cure
Glass transition temperature (Tg) 118.0 °C
Thermal conductivity 0.4 W/mK
Thixotropic index 4.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 9830.0 mPa·s (cP)